Industrial Control Electronics PCB Assembly

Industrial Control Electronics PCB Assembly

shenzen xinaoxun co.LTD has extensive experience in providing our worldwide customers with one-stop PCB&PCBA manufacturing solutions of Industrial Control Electronics.

product detail

Place of Origin:
Shenzhen, China
Minimum Order Quantity:
1 piece
Size:
≤ 510mm*510mm
Material:
General/High Tg FR4, High CTI, Aluminum Base, Copper Base, Rogers, Taconic, Arlon, Teflon, Isola, PI, Dupont, Panasonic
Finished Copper Thickness:
1/3oz – 30oz
PCB Layer:
1-30
Color:
Glossy/Matte: Green, Blue, White, Black, Red, Yellow, Purple, Pink
Finishing:
HASL Lead-free, ENIG, Immersion Tin, Immersion Silver, hard Gold plating (1-100U
Certificate & Quality:
ISO9001/IATF16949, IPC-A-610F, IPC Class II/Class III

product description

Shenzen Xinaoxun co., LTD has extensive experience in providing our worldwide customers with one-stop PCB&PCBA manufacturing solutions of Industrial Control Electronics. We have extended our certification to the successful ISO9001:2015 and has a great advantage in the manufacture of Industrial Control electronics PCBA in terms of high-tech, rich experience and cost down.

Quality control

(1) Sticking Board: Detect whether the SMT mounting position is correct or not, greatly reduce the time waste of SMT trial production and components waste, and effectively ensure the quality of components mounting.

(2) First Article Inspection (FAI): mainly used in the detection of the first piece of board, to detect wrong devices, missing devices, polarity, direction, silk-screen printing and etc. Compared with manual detection, its accuracy is higher and its speed is 50% higher.

(3) Automatic 3D Solder Paste Inspection (SPI): Detect missed printing, Insufficient Paste, Excessive Paste, Bridging, deviation, bad shape, surface pollution and other types of solder paste printing quality problems.

(4) AOI: Detect various defects on the board after reflow soldering: short circuit, parts missing, polarity error, displacement, wrong parts

(5) X-ray: Open circuit and short circuit detection of BGA, QFN devices.

(6) Aging Test/ICT/FCT: multiple functional guarantee of tests could be added according to product requirements.

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